Pressure sensor without isolation diaphragm — Series 2-4

Description

Sensor series 2, 3, and 4 are designed for direct mounting on an electronics board. The sensitive element is a piezoresistive silicon chip located on a glass substrate. The chip is attached to the substrate and placed in a housing with convenient process connection. A strong, stable, and reliable output signal allows the sensor to be connected to a standard amplifier.

All sensors undergo testing for temperature, stability, linearity, and are supplied with a calibration certificate.

Series 2

The medium directly contacts the silicon chip and affects the Wheatstone bridge (a bridge for measuring resistance). Used only for dry gases.

Series 3

The sensor is placed in an aluminum housing. The housing and sensor are protected by a thin foam layer (7 µm parylene). This layer provides full protection in applications where condensation may occur. Prolonged exposure to liquid is not recommended. The average time the foam can protect against water is 6 months.

Series 4

The medium acts on the back side of the silicon chip. This medium can be a liquid. Available application media: gas, water, and non-aggressive liquids. Ideal for measuring negative pressure.

Applications

Barometer, gliders, small aircraft, meteorology, pneumatic control instruments, robotics, hygienic and pharmacological gases, ventilation systems.